Dongguan City Betterly New Materials Co., Ltd.

HJT Main grid silver (copper) paste SF-3000A series

The SF-3000A series is a curable polymer conductive paste designed for printing the main grid of N-type silicon heterojunction cells. It exhibits excellent bulk resistivity and contact resistivity on TCO cells, along with high solder pull strength, fine printing characteristics, and low silver consumption.

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Category: Conductive Silver Paste
  • Product Features Of HJT Main grid silver (copper) paste SF-3000A series

    • High-definition printing, defect-free printing with openings≤30μm.

    • Excellent adhesion and soldering performance.

    • Low-temperature soldering performance and low resistivity.

    • Contact resistance stability


  • Performance Parameters Of HJT Main grid silver (copper) paste SF-3000A series

    Item

    SF-3000A

    SF-3000A-AC

    SF-3000A-AC

    SF-3000A-AC

    Test method

    Solid content(Wt%)

    96±2

    96±2

    96±2

    96±2

    GB/T1725-79,

    200℃ , 30min

    Silver content

    (Wt%)

    93%

    40-50%

    35%

    30%

    According to the formula quantity

    FOG (µm)

    4th scratch

    50%

    7

    ≤3

    7

    ≤4

    7

    ≤4

    7

    ≤4

    GB/T17473.2-20

    08

     

    Viscosity(Pa.S)

     

    90-120

     

    100-120

     

    100-120

     

    100-120

    Brookfield DV-

    Ⅱ , 25℃ , S14,

    35rpm

    Resistivity ( Ω ·cm)

    <7.0*10-6

    <7.5*10-6

    <7.5*10-6

    <7.5*10-6

    GB/T17473.3-20

    08

    Pat Point pull-out

    force(N)

     

    ≥1.5N

     

    ≥1.5N

     

    ≥1.5N

     

    ≥1.5N

    180 °Pull-out,

    200mm/min,

    320℃ Welding


     Recommended screen printing and curing parameters:

     

    Item

    Index

    Screen parameters and opening

    360-16 or 430-13 (50-80)um Opening, with/without

    mesh knot

    EOM thickness

    12-20um

    Printing speed

    300-400mm/s

    Curing Parameters

    180~220℃ 8~30min


  • Storage & Shelf life Of HJT Main grid silver (copper) paste SF-3000A series

    Paste must be sealed in a cool, dry and well-ventilated place, with a storage temperature of -20 to 0℃.

    The shelf life of the product is 6 months.

  • Package Of HJT Main grid silver (copper) paste SF-3000A series

    2Kg/drum


  • Notes Of HJT Main grid silver (copper) paste SF-3000A series

    1.  Stir thoroughly before printing  and allow to rest briefly before use,and ensure the screen is clean and dry.

    2.  It is recommended to maintain an ambient temperature of 20~25℃ and humidity ≤60% during use.

    3.  The  viscosity  of the  conductive  silver  paste  has  been  adjusted.  Do  not  add  thinner when starting use. During continuous printing, add paste incrementally; do not add too much at once.

    4.  Once opened, silver paste must be used within 24 hours. Any unused silver paste must not be left uncovered; it must be stored with both inner and outer lids securely closed.

    5.  When  using  silver  paste  after  removal  from  refrigerated  storage,  first  allow  the  paste  to equilibrate at operating temperature (typically 20℃~25℃) for ≥6h. Critical note: Do not open the silver paste container during equilibration; maintain the container in a sealed state. After temperature equilibration is complete, open the lid and stir thoroughly.

    6. The operating environment should not contain corrosive gases such as sulfides or chlorides.

    7.  Workers  must  wear  masks,  hats,  gloves,  and  other  protective  gear.  Do  not  use  personal protective equipment containing sulfides;

    8.  If it comes into contact with the skin, wash it immediately with water and soap.

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