After our last discussion on silver-coated copper paste, we received numerous messages from the background. When summed up, they all boil down to three highly practical questions. Today, we won’t talk about concepts, but focus on how we use the underlying capabilities of powder-paste integration to resolve these concerns one by one.
Is it Adhered Firmly and Welded Stably?
Worry about interfacial adhesion is essentially worrying that the paste, substrate and solder strip are disconnected from one another. For the traditional "purchasing powder and formulating paste" model, this is indeed a tough formulation problem. But for us, it is an issue that can be solved right from the source of powder structure.
Thanks to powder-paste integration, we are not just "chefs" of formulations, but also "breeders" of raw materials. Our self-developed silver-coated copper powder exhibits a perfect core-shell structure—uniform and dense—under the electron microscope.
This means:
Adhesion with different substrates
We can adjust the surface state and morphology of the powder in a targeted manner according to the characteristics of substrates (silicon wafers, glass, flexible films, etc.), enabling the paste to achieve a doubly firm combination with substrates from physical anchoring to chemical bonding.
Connection with solder strips or electrodes
We can optimize the surface chemical state of the powder, making it form a tough and elastic interface with solder strips and conductive layers during sintering or curing, which resists long-term thermal stress fatigue.
Will it Oxidize and Fail in Long-Term Outdoor Use?
Copper oxidation is a universally recognized challenge. Our solution is not simply "applying a layer of protective paint", but building a triple protection system throughout the material from the perspective of material gene:
Powder Gene Protection (Core Reinforcement)
In the synthesis stage, the surface of the copper core is passivated to inhibit its oxidation tendency.
Innate Structural Protection (Physical Isolation)
The uniform and dense nano-silver shell coating the copper core can isolate copper from the external environment, playing a key role in physically blocking oxygen.
Paste System Protection (Active Elimination)
Antioxidant components are introduced into the organic carrier to slow down the effect of oxygen on copper during sintering or curing, further enhancing the overall antioxidant capacity.
This systematic protection from "powder" to "paste" allows our products to stably pass stringent reliability tests such as DH2000 and TC600. Our confidence in product reliability stems from the complete technical closed loop we have built from the source.
Can It Be Directly Used on My Production Line?
This is the most practical question from customers. Customers' production lines vary greatly, and their application scenarios are also different. Having been deeply engaged in the photovoltaic field for many years, we are now expanding the application of silver-coated copper technology to broader fields such as 3C electronics, semiconductors and conductive films relying on this core technology.
We firmly believe that the best paste is not the one with the highest parameters, but the one that best fits your existing equipment and processes.
Therefore, our answer is not to provide a list of standard products, but a set of in-depth collaborative "turnkey" service model. Its core is still the unique agility endowed by powder-paste integration:
1. Ultra-Fast Response from Demand to Sample
When you put forward a new demand—whether it is adjusting the silver content to cope with cost pressure or adapting to a brand-new substrate or process—the traditional model requires a long process of searching and verifying new powders in the external supply chain. Relying on our independent powder R&D capability, we can simultaneously launch powder fine-tuning and formula adaptation in the internal laboratory, drastically shortening the development cycle from "weeks" to "days" and quickly providing targeted samples.
2. Personalized Escort from Sample to Mass Production
Providing samples is just the starting point. Our engineers will enter your production line with customized solutions and debug the process side by side with your team. What we can adjust is not only the paste formula, but also the characteristics of the powder itself according to on-site conditions, ensuring a precise match with your equipment.
3. Joint Development for the Future
We always keep pace with the cutting-edge technological exploration of the industry. Beyond the photovoltaic field, we have established joint development mechanisms with many leading enterprises and research institutions in 3C electronics, semiconductors, conductive films and other fields. For customers with clear cost reduction goals and innovative ambitions, we are willing to be their most reliable material R&D partner to jointly define solutions for the next-generation applications.
Powder-paste integration is never a slogan for us; it represents a definite business capability: no matter how unique your processes are or how novel your application scenarios are, we can provide certain support from concept to mass production with higher speed and precision.
Silver-coated copper technology is stepping onto a broader stage from the photovoltaic field—3C electronics, semiconductor packaging, conductive films... Its maturity cannot be achieved without close collaboration across the industrial chain.
Betely’s role is to be a professional material system solution provider. With our in-depth understanding and control of fundamental materials, we turn customers' "three anxious questions" into "trustworthy answers". What we provide to customers is not just a silver-coated copper paste, but also performance commitments and mass production guarantees based on in-depth collaboration.
Let us walk the path of cost reduction more steadily and faster together.
