Copper Powder: More Than Just “Grinding Copper into Powder”

In the previous two articles, we discussed silver-coated copper powder. Some readers then asked: If the silver-coated copper powder is synthesized in-house, is the copper powder itself also independently developed?

The answer is yes.

With many years of experience in copper powder preparation, Betely has accumulated extensive expertise in this field. Although copper powder production may appear simple, it actually involves significant technical barriers.

Depending on the preparation process, copper powder on the market can be classified into several types, including electrolytic, atomized, reduction, chemical, and mechanical methods.

Even though they are all copper powders, their performance can vary greatly when used in conductive pastes. In essence, the manufacturing process (“origin”) determines the powder’s performance characteristics (“personality”).

Copper Powder Preparation Processes: Different Methods, Different Properties

Different production processes result in variations in particle morphology, particle size, and surface condition, which ultimately influence the performance of conductive pastes.

Below is a summary of the core characteristics and typical applications of each production method:

For conductive paste applications, the powder material represents the first critical step. It typically requires:

• Fine particle size

• Uniform morphology

• Active surface

Among all available processes, the chemical synthesis method best meets these requirements.

Betely Cu-H Series: Chemically Synthesized Copper Powder for Conductive Pastes

With more than 20 years of experience in conductive material development, Betely has consistently insisted on independent powder synthesis, covering products from silver powder to silver-coated copper powder and now copper powder.

The Cu-H series copper powder is synthesized using a chemical method, specifically designed for conductive paste applications. It offers four key advantages:

1. Uniform Particle Size

Particle size can be flexibly adjusted from submicron to micron levels, with a narrow distribution, making it easier to optimize conductive paste formulations.

2. High Sphericity

The powders exhibit excellent flowability, improving printing performance in paste applications.

3. Advanced Surface Treatment

An anti-oxidation modification is completed before shipment, leaving a sufficient processing window for downstream applications.

4. High Purity

Impurity levels are strictly controlled to avoid any negative impact on electrical conductivity.

Cu-H Series Product Specifications

To meet the needs of different conductive material applications, the Cu-H series includes four models with distinct particle sizes and physical properties.

Cu-H-07

Cu-H-20

Cu-H-30

Cu-H-40

SEM Testing Information

Betely has also released SEM (Scanning Electron Microscope) inspection data for the Cu-H series powders.

Core Application Areas of the Cu-H Series

Copper powder has clearly defined application scenarios. The Cu-H series mainly targets four key sectors. Each application has slightly different performance requirements, which is why the series includes multiple particle size models to provide precise material selection for customers.

1. Photovoltaic Conductive Pastes

Compatible with silver-coated copper systems or pure copper systems.

2. PCB Through-Hole Metallization

Suitable for use in silver-coated copper or pure copper conductive systems in Printed Circuit Board Manufacturing.

3. Conductive Inks

Designed for flexible printed electronics.

4. Conductive Adhesives

Applied in electronic packaging and assembly processes.

Next Article Preview

This article introduced copper powder preparation processes and the product system of Betely’s Cu-H series copper powder.

In the next article, we will explore the microscopic world of the Cu-H series, including:

• The precision of particle size distribution

• The actual sphericity performance of the powders

• The

• — how oxidation resistance is balanced with electrical conductivity.