HJT Front and back sub-grid silver copper paste SF-3000C series

Name: HJT Front and back sub-grid silver copper paste SF-3000C series
Brand: Dongguan City Betterly New Materials Co., Ltd.
Price: 100 USD

SF-3000C is a curable conductive silver-copper paste suitable for printing the front and back sub-grids on N-type silicon wafers for heterojunction solar cells. The SF-3000C series offers a comprehensive range of silver-copper pastes with varying silver contents. It exhibits excellent resistivity and wetted contact resistivity on TCO silicon wafers, enabling high-speed, sustainable printing of photovoltaic cells.

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Category: Conductive Silver Paste

Product Features Performance Parameters Storage & Shelf life Package Notes

Product Features Of HJT Front and back sub-grid silver copper paste SF-3000C series
- Pure spherical silver and silver-copper powder system adapts to finer screen openings. Suitable for both screen printing and stencil printing.
- Low-temperature welding properties and low resistivity.
- Contact resistance stability.

Performance Parameters Of HJT Front and back sub-grid silver copper paste SF-3000C series

Item	Front sub-grid	Front sub-grid	Front sub-grid	Front sub-grid	Test method
Solid content （Wt%）	95±1	95±1	96±1	96±1	GB/T1725-79 200℃ , 30min
Silver content （Wt%）	50-55%	40-50%	30-40%	20-30%	According to the formula quantity
FOG（um） 4th scratch 50%	7 ≤4	7 ≤4	7 ≤4	7 ≤4	GB/T17473.2-2008
Viscosity （pa.s）	100~ 130	100~ 130	100~ 130	90~ 130	Brookfield DV2T 25℃ , S14 ，35rpm
Resistivity ( Ω ·cm）	5.0~5.5*10-6	5.0~5.5*10-6	5.5~6.0*10-6	6.0~8.0*10-6	GB/T17473.3-2008
Item	Back sub-grid	Back sub-grid	Back sub-grid	Back sub-grid	Test method
Solid content （Wt%）	95±1	95±1	96±1	96±1	GB/T1725-79 200℃ , 30min
Silver content （Wt%）	40-45%	30-40%	20-30%	<20%	According to the formula quantity

Recommended screen printing and curing parameters：

Item	Index
Screen parameters and opening	520-11 、 ≥16um opening, without mesh knot Steel plate printing： ≤12um opening
PI thickness	7±1um
Printing speed	350-450mm/s 、Ink return speed 800-1000mm/s
Curing Parameters	Flat Hearth Furnace 190~220℃8~ 12min Cassette Furnace 180~200℃25-30min

Storage & Shelf life Of HJT Front and back sub-grid silver copper paste SF-3000C series

Long-term storage: Refrigerate at -20-0 °C. Shelf life: 6 months.
Short-term storage: Store in a cool, dark place at 0-20 °C for no more than 7 days.
Package Of HJT Front and back sub-grid silver copper paste SF-3000C series

2Kg/drum
Notes Of HJT Front and back sub-grid silver copper paste SF-3000C series

1. Refrigerated silver paste needs to be fully warmed up for 4-6 hours before printing, and centrifuged and stirred evenly, while avoiding obvious heating during the centrifugation process.
2. Printing environment temperature is controlled at 20~25℃ and the humidity is ≤60%.
3. When opening the silver paste container for use, add thinner as needed, with a recommended ratio of 0. 1%-0.4%. During continuous printing, it is advisable to replenish the paste gradually.
4. Unused silver paste after opening, or recycled silver paste, should be stored in a sealed container in the refrigerator or in a cool, dark place, depending on frequency of use.
5. Corrosive gases such as sulfide and chloride need to be controlled in the printing environment.
6. Operators must wear clean clothes, masks and gloves, etc., and must not use labor protection products containing sulfides.
7. If silver paste comes into contact with skin, wash with water or soapy water.
8. The recovered slurry may be adjusted to a suitable viscosity by adding thinner according to its viscosity, and secondary filtration may be required if necessary.