Thermal conductivity: 2~12 W/m-K for efficient heat dissipation.
High extrusion rate to boost dispensing throughput.
No cracking or sagging at 0.2 mm, 0.5 mm and I mm bond line thickness under vibration, -40°C~125°C thermal shock, 150°C high temperature, and 85°C/85% RH high temperature & humidity conditions.
| Test Items | Test method | Unit | TCG-7065 | TCG-7012 |
| Single/Dual Component | One-Component | One-Component | ||
| Mixed Color | Gray | Blue | ||
| Appearance | Paste | Paste | ||
| Density | ASTM D70 | g/cm³ | 3.5 | 3.8 |
| Mixed Viscosity @ Shear Rate 1 (1/s) | GB/T 2794 | Pa.s | 540 | 884 |
| Mixed Viscosity @ Shear Rate 10 (1/s) | GB/T 2794 | Pa.s | 212 | 319 |
| Hardness | ASTM D2240 | shore00 | 60 | 75 |
| Thermal Conductivity | ASTM D5470 | W/m-K | 6.2 | 12 |
| Working Time | 14days | 7days | ||
| 25°C Curing Time | - | hrs. | - | - |
| 80°C Curing Time | mins. | 120@100°C | 120@100°C | |
| Benchmark product (Dow) | TC-3065 | TC-3120 |