The Betely Thermal Conductive Silicone Series is engineered to meet stringent requirements for high-efficiency heat dissipation, long-term operational reliability and manufacturing process compatibility across computing, communications, consumer electronics (3C), new energy vehicles, electric power and renewable energy industries.
Targeting critical thermal management challenges arising in high-power-density applications including AI computing chips, 5G base stations and power battery packs, we have completed systematic formula verification and reliability testing. Our products are now fully validated for stable large-scale mass deployment.
Boasting core strengths of high thermal conductivity, low thermal resistance and outstanding long-term stability, our portfolio includes thermal greases with thermal conductivity ranging from 3.5 to 6.3 W/m·K and thermal gels rated 2.3 to 12.5 W/m·K for flexible configuration against diverse heat dissipation demands. Optimized for high-power chips, IGBT modules, optical modules and other components, our materials enable manufacturers to streamline thermal design workflows, cut system operating temperatures and extend product service life, laying an efficient and robust material foundation for your full-spectrum thermal management needs.