TCG-80XX Series Thermal Gel - Dongguan City Betterly New Materials Co., Ltd.

Silicone Rubber 

Silicone Additives 

Silicone Resin 

Silicone Fluid/Silicone Oil 

Silane & Siloxane & Silazane 

Phenyl Silicone Materials 

LED Encapsulation Materials 

Silicone Gel 

Thermal Conductive Silicone 

TCG-80XX Series Thermal Gel

The TCG-80XX series thermal gel is a high-performance two-component thermal gel with high thermal conductivityahd excellent long-term high-temperature resistance. After curing, it fills the gaps between heat sources and heat sinksto dissipate heat, relieve stress and reduce vibration It suits new-energy-vehicle battery packs, IGBT power-controlunits and similar applications, with different models covering low- to high-power needs at an excellent cost-performance ratio.

Advantages

Thermal conductivity: 2~10 W/m-K for efficient heat dissipation.
High extrusion rate to boost dispensing throughput.
No cracking or sagging at 0.5 mm, 1 mm and 2 mm bond line thickness under vibration, -40°C~125°C thermalshock, 150°C high temperature, and 85°C/85% RH high temperature & humidity conditions.

Performance evaluation

Test Items	Test method	Unit	TCG-8023	TCG-8040	TCG-8060	TCG-8125
Single/Dual Component			Two-Component	Two-Component	Two-Component	Two-Component
Mixed Color			Gray	Blue	Blue	Blue
Appearance			Paste	Paste	Paste	Paste
Density	ASTM D70	g/cm³	2.7	3.5	3.8	3.8
Mixed Viscosity @ Shear Rate 1 (1/s)	GB/T 2794	Pa.s	821	700	418	982
Mixed Viscosity @ Shear Rate 10 (1/s)	GB/T 2794	Pa.s	300	195	184	520
Extrusion Ratio		g/min	65	90	56	25
Hardness	ASTM D2240	shore00	52	58	60	60
Thermal Conductivity	ASTM D5470	W/m-K	2.35	4.4	6.2	12.5
Working Time			45mins	3hrs	3hrs	3hrs
25℃ Curing Time		hrs.	24	24	24	24
80℃ Curing Time		mins.	30	30	30	30
Benchmark Product (Momentive)			TIA225GF	TIA241GF
Benchmark product (Dow)			TC-4025/4525	TC-4040	TC-4060