As AI chip power consumption continues to rise, conventional thermal interface materials are approaching their performance limits. Building on three parallel technology pathways - liquid metal thermal paste, low-thermal-resistance curable thermal gel, and modified phase-change materials - Betely is advancing the development of next-generation thermal management materials.
Liquid Metal Thermal Paste LMC-307X (Under Development)
Liquid metal thermal interface materials can achieve thermal conductivity of 9.54-46.03 W/mK, far exceeding that of conventional silicone-based systems. However, their practical application is constrained by three major technical challenges: material separation during application, pump-out under thermal cycling, and corrosion of aluminum heat sinks.
Current key performance indicators for LMC-307X:
● Thermal conductivity of 7.2 W/mK and thermal resistance of 0.01-0.02 °C·cm²/W
● In testing on an NVIDIA GeForce RTX 4090 chip, the measured T0 temperature was approximately 1 °C lower than with TCC-3251
● Passed 5,000 high- and low-temperature cycles with no significant pump-out, hotspots, or liquid metal separation
● No significant material separation during mixing or printing
Further development will focus on strengthening pump-out resistance and maintaining zero material separation throughout long-term aging tests.
Low-Thermal-Resistance Curable Thermal Gel TCG-701X (Under Development)
● Target thermal conductivity of approximately 7.0 W/mK and thermal resistance of approximately 0.02 °C·cm²/W
● T0 test performance on NVIDIA GeForce RTX chips superior to conventional phase-change materials (PCMs) and premium thermal greases
● Target qualification through 10,000 high- and low-temperature cycles with no pump-out, interfacial delamination, or hotspots
Modified Phase-Change Material MPC-306X (Under Development)
Conventional phase-change materials face two persistent industry challenges: a measurable failure rate during pre-baking that leads to rework, and the risk of pump-out during later-stage operation on large, high-power chips.
Technical targets for MPC-306X:
● Thermal conductivity of approximately 6.5 W/mK and thermal resistance of approximately 0.03 °C·cm²/W
● T0 performance superior to existing PCMs
● Qualification through 10,000 high- and low-temperature cycles with no significant pump-out or hotspots
● Differentiated advantages in pre-baking yield and pump-out resistance for large-die chips
Competition in next-generation thermal management ultimately comes down to balancing the performance limits of materials with engineering reliability. Liquid metal offers a higher thermal conductivity ceiling, but manufacturability and long-term stability must be addressed at the same time. High-conductivity thermal gels retain the process-friendly advantages of silicone-based systems while seeking the best balance between reworkability and heat-dissipation performance. Modified phase-change materials, meanwhile, aim to establish a new technical pathway for applications with fluctuating power loads.
By advancing all three technology routes in parallel, Betely aims to provide forward-looking solutions precisely matched to customers with different power levels, manufacturing processes, and cost constraints.
