LED-Filament Encapsulating Silicone

Name: LED-Filament Encapsulating Silicone
Brand: Dongguan City Betterly New Materials Co., Ltd.

The material is a two-component silicone encapsulation, it is mainly applied to high refractive index SMD. It has the advantage of excellent sulfur resistance, high luminousness, high refractive index, good weather resistance, good heat resistance, good fluid property, good heat resistance and long operation time, ect.

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Category: High Refractive Index

Specification Of LED-Filament Encapsulating Silicone

Model No.	BQ-4238	BQ-4238 (S)	BQ-4242	BQ-4216
Functional group	Phenyl silicone resin
Curing time	80-110℃/1h+150℃/3hrs
Before Cured
Apperance	Transparent/Transparent
Mixed viscosity (25℃) mPa·s	5000	4000	5500	5700
Refractive index	1.54
Light transmittance	92%
After cured
Viscosity（25℃） g/cm3	1.16
Hardness shore A	50°	45°	60°	55°
Linear expansion coefficient	202	202	200	202
Tensile strength (MPa)	1.5	2	2.8	2.6
Glass transition temperature Tg ℃	30°	29°	38°	36°
Oxygen permeability cm3/m2 ·24h	370	390	350	345
Permeable rate g/m2 ·24h	9.1	9.1	8.7	8.4

Using Manual Of LED-Filament Encapsulating Silicone

Mix the phosphors A, B, and phosphors in proportions until there is no agglomeration, and after they are uniformly thin and thick, put them in a vacuum to completely defoam.
Pour the rubber into the syringe to fill the glue, and put the syringe filled with the rubber in a vacuum to drain bubbles again.
Before pouring the glue, preheat the bracket or base to remove moisture and avoid bubbles during curing.
Finally, two stages of baking are carried out, first low-temperature initial curing reaction, and then high-temperature baking complete curing.

LED-Filament Encapsulating Silicone

Specification Of LED-Filament Encapsulating Silicone

Using Manual Of LED-Filament Encapsulating Silicone

Product Certificate Of LED-Filament Encapsulating Silicone

Package Of LED-Filament Encapsulating Silicone

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