The material is a two-component silicone encapsulation, it is mainly applied to high refractive index SMD. It has the advantage of excellent sulfur resistance, high luminousness, high refractive index, good weather resistance, good heat resistance, good fluid property, good heat resistance and long operation time,ect.
LED-Filament Encapsulating Silicone
Description
|
Model No.
|
BQ-4238
|
BQ-4238（S ）
|
BQ-4242
|
BQ-4216
|
|
Functional group
|
Phenyl silicone resin
|
|||
|
Curing time
|
80-110℃/1h+150℃/3hrs
|
|||
|
Before Cured
|
||||
|
Apperance
|
Transparent/Transparent
|
|||
|
Mixed viscosity（25℃）
mPa·s
|
5000
|
4000
|
5500
|
5700
|
|
Refractive index
|
1.54
|
|||
|
Light transmittance
|
92%
|
|||
|
After cured
|
||||
|
Viscosity（25℃）
g/cm3
|
1.16
|
|||
|
Hardness shore A
|
50°
|
45°
|
60°
|
55°
|
|
Linear expansion coefficient
|
202
|
202
|
200
|
202
|
|
Tensile strength（MPa）
|
1.5
|
2
|
2.8
|
2.6
|
|
Glass transition temperature Tg ℃
|
30°
|
29°
|
38°
|
36°
|
|
Oxygen permeability
cm3/m2 ·24h
|
370
|
390
|
350
|
345
|
|
Permeable rate
g/m2 ·24h
|
9.1
|
9.1
|
8.7
|
8.4
|
1. Mix the phosphors A, B, and phosphors in proportions until there is no agglomeration, and after they are uniformly thin and thick, put them in a vacuum to completely defoam.
2. Pour the rubber into the syringe to fill the glue, and put the syringe filled with the rubber in a vacuum to drain bubbles again.
3. Before pouring the glue, preheat the bracket or base to remove moisture and avoid bubbles during curing.
4. Finally, two stages of baking are carried out, first low-temperature initial curing reaction, and then high-temperature baking complete curing.
1kg/bottle
Reviews
There are no reviews yet.